Exciting career in R&D and be a technical leader in assembly process development In your new role you will :
- Engage internal and external stakeholders and align with the big picture or Package / Process Roadmap
- Establish mold process for new IC product which meets product performance and quality
- Proactively work and propose solutions to ensure best in class time to market for Infineon products
- Have an impact on product quality, project cost and timeline
- Lead, coach and continuously develop the competency of the unit process development team at multi sites
- Guide junior engineer in focus team topic / lead focus team of high complexity and task force.
You are best equipped for this task if you have :
Education qualification in Master / Bachelor Degree in Mechanical / Materials / Process EngineeringMinimum 7 Years of IC / Semiconductor assembly industryPossess in-depth knowledge in Molding process, equipment, materials, and their interactionsIndependent with good communication and coordination skillsDemonstrates an ability to lead a team in problem-solvingAnalytical mind and high initiative to challenge him / herself to move the next level of competencyKnowledgeable in IC Packaging Assembly Process FlowExperience in analytical tools ( JMP, 8D, FMEA, SPC, DMAIC approach to problem solving) and design of experiments.Benefits
Coaching, mentoring networking possibilitiesWide range of training offers & planning of career developmentInternational assignmentsDifferent career paths : Project Management, Technical Ladder, Management & Individual ContributorMedical CoverageOn-site social counselling and works doctorHealth promotion programsOn-site canteenWage payment in case of sick leaveFlexible transition into retirementPerformance bonus